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INTEGRATED CIRCUITS
DATA SHEET
TEA6810V; TEA6811V Front-end and PLL synthesizers for car radios
Product specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1996 Jun 18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
FEATURES * Synthesizer function which includes a Voltage Controlled Oscillator (VCO), dividers, phase detector, charge-pump and in-lock detector * FM mixer with AGC * AM RF amplifier with AGC * AM mixer. APPLICATIONS * Car radios. GENERAL DESCRIPTION The TEA6810V and TEA6811V, together with TEA6821V forms an AM/FM receiving concept for electronically tuned car radios. The TEA681xV is an FM/AM front-end with one local synthesized oscillator for both AM and FM which is used together with the TEA6821T in a double-conversion concept. It delivers a first FM-IF of 72.2 MHz and, for MW/LW, a first AM-IF of 10.7 MHz. QUICK REFERENCE DATA SYMBOL VCCA1 VCCA2 VAMant VFMant fAMant fFMant Tamb PARAMETER analog supply voltage (pin 2) analog supply voltage (pin 13) AM AGC range FM AGC range AM input frequency FM input frequency operating ambient temperature see Fig.4 see Fig.5 CONDITIONS
TEA6810V; TEA6811V
Minimum alignments are required due to wideband RF inputs and the common AM/FM VCO. High dynamic behaviour and minimum distortion is obtained by a special RF input design combined with AGC. High sensitivity is possible in combination with RF input FETs. Minimum interference is experienced due a to special synthesizer loop design and ensuring that the I2C-bus is inoperative in the locked-tuned condition. The reference frequency for the synthesizer and the I2C-bus information is delivered by the TEA6821V. The programmable local/dx switch enables switching the gain of the FM mixer from normal AGC control (FM dx) to the forced 4th level of AGC (FM local).
MIN. 4.75 8.1 0.3 10 0.144 60 -40
TYP. 5.0 8.5 - - - - -
MAX. 5.25 8.9 6.0 600 22 108 +85 V V V
UNIT
mV MHz MHz C
ORDERING INFORMATION TYPE NUMBER TEA6810V TEA6811V PACKAGE NAME VSO40 VSO40 DESCRIPTION plastic very small outline package; 40 leads plastic very small outline package; 40 leads; face down VERSION SOT158-1 SOT158-2
1996 Jun 18
2
ndbook, full pagewidth
1996 Jun 18
VCCOSC OSCFDB OSCGND FMAGCref OSCTNK 36 35 37 38 34 PIN DIODE DRIVER FMRFIN IPIDIO 32 FMRFIP 30 31 AM/FM OSCILLATOR VTUNE CHPOUT 39 40 CHARGE PUMP BUFFER BUFFER
BLOCK DIAGRAM
Philips Semiconductors
Front-end and PLL synthesizers for car radios
FMIFOP
AMAGCC
AMSB2
AMPREI AMSB1
FMIFON 11 FM
FMAGCC 12 33 27
AMPREC 28 25
24
26 22 AMPREO
AM
RF
AM/FM
AM/FM
AM/FM
TEA6810V TEA6811V
18 AMMIN
N2
AM
3
LCKDET VCCA2 AGND2
3
LOCK DETECTOR
AM/FM
13 PHASE DETECTOR 14
PROGRAMME DIVIDER N1
I2C-BUS CONTROL
BAND GAP
19
Vref
1 AGND1
6 frefN
7
2
17
23 n.c.
10 n.c.
20 n.c.
5 SCL
4 SDA
8 DGND
9 VCCD
15
16
21
29
TEA6810V; TEA6811V
frefP VCCA1 n.c.
AMMON AMMOP
AMMGND RFGND
MGE727
Product specification
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
PINNING PIN(1) SYMBOL TEA6810 AGND1 VCCA1 LCKDET SDA SCL frefN frefP DGND VCCD n.c. FMIFON FMIFOP VCCA2 AGND2 AMMOP AMMON n.c. AMMIN Vref n.c. AMMGND AMPREO n.c. AMSB1 AMSB2 AMPREI AMAGCC AMPREC RFGND FMRFIP FMRFIN IPIDIO FMAGCC FMAGCref OSCFDB OSCGND OSCTNK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 TEA6811 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 analog ground 1
TEA6810V; TEA6811V
DESCRIPTION
analog supply voltage 1 (+5 V) lock detector flag serial data input/output; I2C-bus serial clock input; I2C-bus reference frequency input from TEA6821 N-terminal reference frequency input from TEA6821 P-terminal digital ground digital supply voltage (+5 V) not connected FM mixer negative output (72.2 MHz) FM mixer positive output (72.2 MHz) analog supply voltage 2 (+8.5 V) analog ground 2 AM mixer positive output (10.7 MHz) AM mixer negative output (10.7 MHz) not connected AM mixer RF input reference voltage output from AM band gap not connected AM mixer ground AM preamplifier output not connected AM feedback switch SB1 AM feedback switch SB2 AM preamplifier input AM AGC capacitor AM preamplifier decoupling capacitor RF ground RF positive input for FM mixer RF negative input for FM mixer pin diode drive FM AGC integrating capacitor FM AGC reference voltage oscillator feedback input oscillator ground oscillator tank output
1996 Jun 18
4
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
PIN(1) SYMBOL TEA6810 VCCOSC VTUNE CHPOUT Note 1. Pins 10, 17, 20 and 23 should be connected to a common ground. 38 39 40 TEA6811 38 39 40
TEA6810V; TEA6811V
DESCRIPTION oscillator supply voltage (+8.5 V) tuning voltage charge pump output
1996 Jun 18
5
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
TEA6810V; TEA6811V
handbook, halfpage
handbook, halfpage
AGND1 VCCA1 LCKDET SDA SCL frefN frefP DGND VCCD
1 2 3 4 5 6 7 8 9
40 CHPOUT 39 VTUNE 38 VCCOSC 37 OSCTNK 36 OSCGND 35 OSCFDB 34 FMAGCref 33 FMAGCC 32 IPIDIO 31 FMRFIN
CHPOUT 40 VTUNE 39 VCCOSC 38 OSCTNK 37 OSCGND 36 OSCFDB 35 FMAGCref 34 FMAGCC 33 IPIDIO 32 FMRFIN 31
1 2 3 4 5 6 7 8 9
AGND1 VCCA1 LCKDET SDA SCL frefN frefP DGND VCCD
n.c. 10
10 n.c.
TEA6810V
FMIFON 11 FMIFOP 12 VCCA2 13 AGND2 14 AMMOP 15 AMMON 16 n.c. 17 AMMIN 18 Vref 19 n.c. 20
MGE725
TEA6811V
30 FMRFIP 29 RFGND 28 AMPREC 27 AMAGCC 26 AMPREI 25 AMSB2 24 AMSB1 23 n.c. 22 AMPREO 21 AMMGND FMRFIP 30 RFGND 29 AMPREC 28 AMAGCC 27 AMPREI 26 AMSB2 25 AMSB1 24 n.c. 23 11 FMIFON 12 FMIFOP 13 VCCA2 14 AGND2 15 AMMOP 16 AMMON 17 n.c. 18 AMMIN 19 Vref 20 n.c.
MGE726
AMPREO 22 AMMGND 21
Fig.2 Pin configuration (TEA6810).
Fig.3 Pin configuration (TEA6811).
1996 Jun 18
6
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
I2C-BUS ORGANIZATION
TEA6810V; TEA6811V
The TEA6810V; TEA6811V is controlled via the I2C-bus which is driven from the TEA6821V. For programming purposes a module address and four data bytes are required. When used partially, the transmission must be ended by a stop condition. Table 1 START S Table 2 Bit organization MODULE ADDRESS byte 0 A PROGRAMMABLE DIVIDER DATA byte 1 A byte 2 A SWITCH CONTROL byte 3 A TEST byte 4 A STOP P
I2C-bus address and received bytes BUS ADDRESS MSB 1 S7 1 S6 0 S5 0 S4 0 S3 1 S2 0 S1 LSB 0 S0
BYTES TO BE RECEIVED (4 BYTES) Byte 1(1) program divider N1 (Low byte) Byte 2(1) program divider N1 (High byte) Byte 3 switching
S15
S14
S13
S12
S11
S10
S9
S8
MSB in-lock counter
LSB in-lock counter
1 = HIGH 0 = LOW current tuning oscillator 1 = test 0 = normal in-lock counter
1 = HIGH 0 = LOW current charge pump X(2)
1 = FM local 0 = FM dx
MSB divider N2
LSB divider N2
1 = FM 0 = AM
Byte 4 testing
1 = 3-state 0 = normal charge pump
1 = fdiv 0 = LCKDET
X
X
X
X
Notes 1. N1 divider ratio is (N + 2); where N is the programmed binary number composed of bytes 1 and 2. For the minimum ratio; if N < 2048 then N1 divider ratio is {2048 + (N - 2)}. 2. X = don't care. Table 3 N2 divider MSB 0 0 1 1 LSB 0 1 0 1 Table 4 In-lock MSB 0 1 1 0 0 LSB 0 0 1 0 1 AM/FM FM AM or FM AM or FM AM AM
N2 DIVIDER 3 5 10 15
IN-LOCK 8 16 32 48 64
1996 Jun 18
7
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCCA1 VCCA2 VCCD VCCOSC Ptot Tstg Ves Note 1. Machine model: equivalent to discharging a 200 pF capacitor through 0 . HANDLING PARAMETER analog supply voltage (pin 2) analog supply voltage (pin 13) digital supply voltage (pin 9) oscillator supply voltage (pin 38) maximum power dissipation storage temperature electrostatic handling note 1 CONDITIONS
TEA6810V; TEA6811V
MIN. -0.3 -0.3 -0.3 -0.3 - -65 -300
MAX. 12 12 12 12 0.55 +150 +300 V V V V W
UNIT
C V
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 90 UNIT K/W
DC CHARACTERISTICS V13 = V38 = 8.5 V; V9 = V2 = 5.0 V; Tamb = 25 C; unless otherwise specified. SYMBOL ICCA1 ICCA2 ICCOSC ICCD IAMMO IFMIFO PARAMETER analog input current (pin 2) analog input current (pin 13) oscillator input current (pin 38) digital input current (pin 9) AM mixer output current (pins 15 and 16) FM mixer output current (pins 11 and 12) CONDITIONS AM mode FM mode AM mode FM mode AM mode FM mode AM mode FM mode AM mode FM mode AM mode FM mode 7 6 17 15 4 6 32 27 8.5 0 0 10 TYP. 9 8 22 18 6 8 35 30 - - - - MAX. UNIT mA mA mA mA mA mA mA mA mA mA mA mA
1996 Jun 18
8
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
TEA6810V; TEA6811V
AC CHARACTERISTICS All voltage and current values are RMS values; noise values are unweighted within the bandwidth 0.03 to 20 kHz; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
AM signal channel; (note 1; see Fig.4) RF PREAMPLIFIER STAGE Z21 Vi2 transimpedance 40 - - - - - - 15(2) - - 2.4 - 130(2) 114(2) - set by I2C-bus; see Table 3 - - - - REFERENCE VOLTAGE (PIN 19) Vo Zo Io(max) output reference voltage output impedance maximum output current - - - 2.75 40 - - - 0.1 V mA 65 - - - - - - - - - 5(2) 3.1 - - - - - - - - k
AGC STAGE; FI2 = 1 MHZ HF input voltage AGC start level 1 AGC start level 2 AGC stop level 1 AGC stop level 2 IAGCsink IAGCsource Ri Ci Co GmC GmC IP3 CP Vn(eq) RN2 AGC sink current AGC source current V18 = V19 + 0.5 V; V27 = V19 V18 = V19 - 0.5 V; V27 = V19 750 850 145 170 1 2 mV mV mV mV A mA
MIXER (fO = 10.7 MHZ) input resistance between pins 18 and 21 input capacitance between pins 18 and 21 output capacitance between pins 15 and 16 conversion transconductance (I15 to I16/V18 to V19 variation in conversion transconductance third-order intermodulation -1 dB compression point equivalent input noise voltage 20 5 - 2.75 -0.005 137 120 9 k pF pF mS mS/K dBmV dBmV nV/Hz
OSCILLATOR/N2 DIVIDER internal divider ratio (N2) 15 10 5 3
1996 Jun 18
9
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
SYMBOL PARAMETER CONDITIONS
TEA6810V; TEA6811V
MIN.
TYP.
MAX.
UNIT
FM signal channel (note 3; see Fig.5) MIXER Ri Ci Ro Co Gm input resistance between pins 30 and 31 input capacitance between pins 30 and 31 output resistance between pins 11 and 12 output capacitance between pins 11 and 12 transconductance I11 to I12/V30 to V31 < VAGC1 I11 to I12/V30 to V31 < VAGC2 I11 to I12/V30 to V31 < VAGC3 I11 to I12/V30 to V31 > VAGC3 GmT F IP3 CP IF1 VAGC(S) variation in transconductance with temperature noise figure (both sidebands) third-order intermodulation -1 dB compression point 1st IF rejection AGC start voltage between pins 30 and 31 start level 1 start level 2 start level 3 VAGC(H) AGC hysteresis voltage hysteresis level 1 hysteresis level 2 hysteresis level 3 R33 Ipin Vpin OSCILLATOR fosc fosc/T oscillator frequency oscillator temperature dependence 116.8 - - -90 207 - MHz 10-6/K FM AGC output resistance pin diode current start level pin diode voltage between pins 30 and 31 V32 = 1.4 V Io = 1 mA 1996 Jun 18
10
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
SYMBOL PARAMETER CONDITIONS
TEA6810V; TEA6811V
MIN.
TYP.
MAX.
UNIT
SYNTHESIZER (see Fig.6)
Reference frequency input (pins 6 and 7)
Vref(p-p) reference frequency input voltage (V6 to V7) (peak-to-peak value) reference frequency transition time input reference frequency for: FM AM standard SW1 AM full-band MW (USA) FM AM full-band SW1 AM standard MW/LW AM full-band MW/LW AM full-band SW2 FM AM standard SW1 AM full-band MW/LW AM full-band SW1 AM full-band SW2 tuning step (kHz) N2 50 5 10 25 5 1 3 5 10 1 1 1 1 - 10 5 - 5 15 5 3 - 10 5 5 3 - - - - - - - - - - - - - 120 0.85 0.2 0.4 -5 - - - - - 50 50 50 25 25 15 15 15 10 10 5 5 5 - - - - - - - - - - - - - 215 1.2 8.25 8.0 +5 16(2) - - - - kHz kHz kHz kHz kHz kHz kHz kHz kHz kHz kHz kHz kHz A mA V V nA Hz ms ms ms ms - 0.4 - V
ttrans fref
-
-
50
ns
Phase detector/charge pump
IOL IOH VOL VOH Ioz fr(p-p) tlock LOW level output charge pump current HIGH level output charge pump current LOW level tuning voltage at charge pump LOW HIGH level tuning voltage at charge pump HIGH 3-state output current residual FM frequency (peak-to-peak value) lock time V40 = 4 V V40 = 4 V IO = 0.5Icharge; V13 = 8.5 V IO = 0.5Icharge; V13 = 8.5 V V40 = 4 V B = 300 Hz to 20 kHz; Icharge = IOL; fi = 100 MHz FM = 88 to 108 MHz FM = 108 to 88 MHz AM = 510 to 1710 kHz AM = 1710 to 510 kHz 175 1 - - - 9 2 2 2 2
1996 Jun 18
11
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
SYMBOL PARAMETER CONDITIONS - - tuning step (kHz) N2 50 25 10 5 1 5 1 3 1 5 1 5 1 10 - - - - 15 10 10 5 5 5 5 3 3 5
TEA6810V; TEA6811V
MIN.
TYP.
MAX. - - 3 604 7208 18020 36040 12420 4140 20700 10973 32920 8240 41200 10640 53200 3292
UNIT
Programmable divider
Nmin Nmax DR minimum programmable ratio maximum programmable ratio divider ratio for: FM FM FM FM AM standard MW/LW AM standard SW1 AM standard SW1 AM full-band MW/LW AM full-band MW/LW AM full-band SW1 AM full-band SW1 AM full-band SW2 AM full-band SW2 AM full-band MW (USA) 2 050 65537 - - - - - - - - - - - - - - - - N x 1fref
2050 6388 15970 31940 10844 3320 16600 10448 31344 6700 33500 8240 41200 3172
In-lock detector (reset by any start condition on
VOH VOL td Notes in-lock HIGH level output voltage (pin 3) in-lock LOW level output voltage (pin 3) in-lock delay
I2C-bus)
4.0 0 5.0 0.4 - V V ms
counter length = N
-
1. fi1 = 1053 kHz; fmod = 400 Hz; m = 0.3; Vi1 = Vi2 = 1 mV; N2 divider switched to divide-by-15. 2. Not measured 100% in production. 3. Vi1 = 1 mV; fi1 = 98 MHz; fmod = 1 kHz; f = 22.5 kHz.
1996 Jun 18
12
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
TEA6810V; TEA6811V
50
handbook, full pagewidth
10 nF
1 mH 33 F
20 k
Vo1
50 V i2 Vref 18 19 AM/FM BAND GAP
22 50 50 Vi1 20 k 4.7 nF 10 k 10 k 33 F 1.5 F 21 26 24 AM 25 28 27 29 V CCOSC 38 1.8 pF 1 nF BB515 10 k V TUNE VCCD 10 k 100 nF 10 k 5V SDA SCL 50 nH 2.7 pF 37 35 36 AM/FM OSCILLATOR AM/ FM 9 I 2 C BUS CONTROL 8 4 5 AM RF
16 15
1:1 200 22 nF
Vo2
TEA6810V TEA6811V
AGC N2 13 VCCA2 12
33 H 100 nF 33 F 8.5 V
8.5 V
AM/ FM
MLB828
Fig.4 AM test circuit.
1996 Jun 18
13
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
TEA6810V; TEA6811V
handbook, full pagewidth
75
100 nF Vo3 50 50
33 29 AGC 31 FM 30
TEA6810V TEA6811V
11 56 pF 1 k Vo1
12
f i1
Vi1 50 34 32
PIN DIODE DRIVE
8.5 V
VCCOSC 38 1.6 pF 37
BUFFER
13 VCCA2 100 nF 14
1 mH 33 F 8.5 V
1 nF 10 k
BB515
50 nH 1
2.7 pF
35
AM/FM OSCILLATOR
Vo2
36 V TUNE I 2 C BUS CONTROL 9 VCCD 10 k 100 nF 10 k 5V 8 4
AM/FM
5
MLB829
SDA SCL
Fig.5 FM test circuit.
1996 Jun 18
14
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
TEA6810V; TEA6811V
handbook, full pagewidth
8.5 V
VCCOSC 38 1.8 pF 37
TEA6810V TEA6811V
BUFFER
1 nF
BB515
50 nH 1
2.7 pF
35
AM/FM OSCILLATOR
2.2 k
Vo1
PROGRAM DIVIDER N1 2 VCCA1 13 5V Viref 0.4 V (p p)
36 39 120 nF 10 k 3.3 nF I 2 C BUS CONTROL 9 VCCD 10 k 100 nF 10 k 5V SDA SCL 8 4 5 LOCK DETECTOR 3 CHARGE PUMP PHASE DETECTOR
1.2 k 8 pF
40
14 1 1.2 k
12 nF
3.6 k
MLB830
Fig.6 Synthesizer test circuit.
1996 Jun 18
15
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
INTERNAL PIN CONFIGURATION
TEA6810V; TEA6811V
handbook, full pagewidth
AGND1 VCCA1 LCKDET
1 40 2 39 3 38 CHPOUT VTUNE VCCOSC OSCTNK OSCGND OSCFDB
SDA
4
TEA6810V TEA6811V
37 36 35
SCL frefN
5 6
34
FMAGCref
frefP DGND VCCD n.c. FMIFON
7 8 9 10 11 32 33 FMAGCC
IPIDIO
FMIFOP VCCA2 AGND2
12 13 14
31
FMRFIN
30 AMMOP AMMON 15 16 28 17 27 29
FMRFIP RFGND AMPREC
n.c.
AMAGCC
26 AMMIN 18 25 24 23 22 Vref n.c. 19 20
MGE728
AMPREI AMSB2 AMSB1 n.c. AMPREO AMMGND
21
Fig.7 Internal pin configuration.
1996 Jun 18
16
dbook, full pagewidth
1996 Jun 18
100 CTC 1 k 6.4 MHz 470 k RS 100 k 47 pF 12 pF O8 O7 O9 150 nF VDD MR 11 12 6 O6 5 4 3 2 1 O4 O5 O13 RTC 9 10 8 7 VSS O3 50 kHz 47 F 1 k 1 k
APPLICATION INFORMATION
Philips Semiconductors
Front-end and PLL synthesizers for car radios
VCCA1
VCCD
DGND
VCCA2
LCKDET SDA SCL
1 mH
1 mH
47 F
47 F
47 F
12 nF 3.3 nF 1 1 k 220 nF 22 k 10 k 1 k 10 k 1 k 3 4 5 6 7 8 100 nF 9 4.7 nF 10 100 ANZAC TP103 4.7 nF 100 11 12 13 14 4.7 nF 4.7 nF 100 100 15 16 17 18 10 nF 1 mH 19 50 47 F 20 22 21
MGE729
3.6 k 120 nF VTUNE 1 pF OSCTNK 2.2 k 1 nF
40 10 k 39 38 1.8 pF 37 50 nH 36 35 2.7 pF 34 33 32 1 nF 31 30 1 nF 29 47 F 1 k 1 k AMAGCC 10 F 25 24 10 k 23 AMPREO 5 k 10 k 50 k AMPREI AMSB2 AMSB1 28 2.2 F 27 20 k 26 50 ANZAC TP101 120 nF 120 nF FMAGCref FMAGCC IPIDIO FMIN
2
HEF4060B
13 14 15 16
100 nF
TR4
O12 O11
47 k
TR2 TR3 TR1
1 k
12.5 kHz
17
FMOUT
TEA6810V TEA6811V
100 nF
TEA6810V; TEA6811V
ANZAC TP103 AMOUT
Product specification
AMMIN
Fig.8 Test board diagram.
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
PACKAGE OUTLINES VSO40: plastic very small outline package; 40 leads
TEA6810V; TEA6811V
SOT158-1
D
E
A X
c y HE vMA
Z 40 21
Q A2 A1 pin 1 index Lp L 1 e bp 20 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3
0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60
0.067 0.089 0.059
0.045 0.024 0.008 0.004 0.004 0.041 0.012
7o 0o
Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1996 Jun 18
18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
TEA6810V; TEA6811V
VSO40: plastic very small outline package; 40 leads; face down
SOT158-2
D y c
E
A X
HE Z 40 21 L Lp (A 3)
vM A
A1 Q A2
A
pin 1 index detail X
1 e bp
20 wM
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3
0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60
0.067 0.089 0.059
0.045 0.024 0.008 0.004 0.004 0.041 0.012
7o 0o
Note 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1996 Jun 18
19
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all VSO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TEA6810V; TEA6811V
Wave soldering techniques can be used for all VSO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Jun 18
20
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA6810V; TEA6811V
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1996 Jun 18
21
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
NOTES
TEA6810V; TEA6811V
1996 Jun 18
22
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for car radios
NOTES
TEA6810V; TEA6811V
1996 Jun 18
23
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 805 4455, Fax. +61 2 805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 708 296 8556 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 615 800, Fax. +358 615 80920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 52 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. +30 1 4894 339/911, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 648 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 83749, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 926 5361, Fax. +7 095 564 8323 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com/ps/ (1) ADDRESS CONTENT SOURCE April 6, 1998 SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands
517021/02/pp24 Date of release: 1996 Jun 18 Document order number: 9397 750 00916

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